View 75341-4444_4456490.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Features and speciFications
1.85 by 1.85mm (.073 by .073") pitch GbX* Backplane connector system in 2, 3, 4 and 5-pair columns 2 and 3 columns:
75650, 75370 differential daughtercard assemblies 75670, 75660 Lite daughtercard assemblies 75676, 75666 Hybrid daughtercard assemblies 75827, 75433 Backplane signal Headers 75861, 75649 Lite Backplane signal Headers 75492, 75331 Backplane power
Top, left to right: 75360, 75220, 75370, 75650. Bottom, left to right: 75237, 75235, 75433, 75827
2 and 3-Pair Columns add to Molex's GbX Backplane Interconnect System Offering, Delivering Speeds Up To 10 Gbps, High Density (Up to 69 Mated Differential Channels Per Inch) and is Custom Configurable Data rates up to 10 Gbps may now be achieved with the GbX 2 and 3-pair column daughtercard and backplane system. The 2 and 3-pair column system completes the GbX product offering, making it a complete solution for high-end telecommunication and datacommunication applications. The GbX connector system provides the speed, density, and low-applied cost required by leadingedge backplane applications. It is especially suited for designs that require future speed upgrades by daughtercard replacement into an existing backplane. With native differential signaling speeds up to 10 Gbps, GbX is well suited for existing and future generations of XAUI (10 Gigabit Attachment Unit Interface) and InfiniBand based systems, in addition to those based on ATCA (Advanced Telecom Computing Architecture) and OIF (Optical Internetworking Forum) chip protocols. Internetworking and telecommunication equipment engineers will benefit by the GbX connector's ability to provide not only a high-density, low applied-cost Features and Benefits n Up to 69 real differential pairs per linear inch (27 real differential pairs per 10.00mm (.393") offers high density with more differential pairs per linear inch than VHDM-HSD* n Bifurcated contact beams in daughtercard receptacle provide greater reliability with two points of contact to header pin n Modular daughtercard components with GbX L-Series available with custom, cost-effective receptacle assemblies n Optimized differential pair contacts for easier board trace routing
75220, 75360 daughtercard assemblies solution in the near term, but also by its electrical performance in upgradeable systems. Speeds of 10 75420 4-pair Lite Gbps have been demonstrated with appropriate SERDES daughtercard (Serializer/ Deserializer) devices and board-material assemblies selection. This allows system architects freedom-ofdesign for faster future systems without the worry of 75426 4-pair Hybrid backward compatibility, along with the economy of a daughtercard common backplane for two generations of equipment. assemblies In addition, the GbX Lite Series system provides a 75235, 75237 Backplane signal complimentary high-density open pin field for costeffective design of slower-speed circuits along the same Headers stiffener as the standard, high-speed GbX wafers. For 75465 4-pair Lite Backplane more information on Molex's extensive GbX offering, signal Header please visit: www.molex.com/product/backplan/gbx. html. 75341, 75510 Backplane power
*GbX and VHDM-HSD are registered trademarks of Amphenol Corporation InfiniBand is a registered trademark of the InfiniBand Trade Association ATCA is a trademark of the PCI Industrial Manufacturers Group
4 and 5 columns:
stand-alone Guide pin Kit:
75234
n Data rate options up to 10 Gbps are able to support future daughtercard speed upgrades
speciFications
1.85 by 1.85mm (.073 by .073") pitch GbX* Backplane connector system in 2, 3, 4 and 5-pair columns
Mechanical Contact Insertion Force: 35.58N (8.00 lb) max. per contact Contact Retention Force: 6.67N (1.50 lb) min. per contact Mating Force: 0.59N (0.13 lb) max. per contact Unmating Force: 0.342N (0.077 lb) min. per contact Durability: 250 cycles max. Physical Housing: Liquid Crystal Polymer, UL 94V-0 Contact: Copper Alloy Plating: Contact Area - 0.76m (30") Gold (Au) min. Compliant Pin Area - Tin (Sn) or Tin/Lead (SnPb) Underplating - Nickel (Ni) PCB Thickness: 1.60mm (.062") min. Operating Temperature: -55 to +105C
2 and 3-pair: Top, left to right: 75370, 75650 Bottom, left to right: 75433, 75827
Reference Information Packaging: Daughtercard Assemblies: Tray Backplane Headers: 2, 4 and 5 Pair- Tray; 3 Pair- Tube UL File No.: E29179 Designed In: Millimeters Electrical Signal/Shield Contact Current Rating: 1.0A Power Contact Current Rating: 6.0A Contact to Plated-Through-Hole Resistance: 1.0 milliohm max. Power Blade Contact Resistance: 3.0 milliohms max. Dielectric Withstanding Voltage: 750V RMS Insulation Resistance: 1,000 Megohms min.
4 and 5-pair: Top: 75220 Bottom: 75235
appLications n Internetworking Equipment: - Servers, Hubs, and Routers n Telecommunications Equipment: - Central Office, Cellular Infrastructure and Multi-platform Service (DSL, Cable Data) systems n Medical Diagnostic Equipment n Test and Measurement Equipment
orderinG inFormation
Daughtercard Assembly *Daughtercards are custom configured. Please visit the Molex Backplane Configurator web site to create a custom daughtercard at: www.molex.com/configurator.html
daughtercard assembly 2-pair 3-pair 4-pair 5-pair
1.85 by 1.85mm (.073 by .073") pitch GbX* Backplane connector system in 2, 3, 4 and 5-pair columns
Signal wafers, power modules, and guide modules sequentially assigned by application Lite wafer blocks, power modules, and guide modules sequentially assigned by application Lite wafer blocks, signal wafers, power modules, and guide modules sequentially assigned by application
75650-XXXX* (High-speed differential pair signal contacts only; wafer 75651-0001 for reference information only) 75670-XXXX* Low-speed signal contacts only, Lite wafer block 75671-0005 for reference information only) 75676-XXXX* (High-speed differential pair signal contacts 75651-0001 and low- speed signal contacts 75671-0005 combined in one assembly)
75370-XXXX* (High-speed signal contacts only; wafer 75371-0001 for reference information only) 75660-XXXX* Low-speed signal contacts only, Lite wafer block 75661-0005 for reference information only) 75666-XXXX* (High-speed differential pair signal contacts 75371-0001 and low-speed signal contacts 75661-0005 combined in one assembly)
75220-XXXX* (Wafer 75221-0001 for reference information only) 75420-XXXX* Low-speed signal contacts only, Lite wafer block 75421-0005 for reference information only) 75426-XXXX* (High-speed differential pair signal contacts 75221-0001 and low-speed signal contacts 75421-0005 combined in one assembly)
75360-XXXX* (Wafer 75361-0001 for reference information only)
N/A
N/A
Backplane Signal Headers Multiple keying options are available; contact Molex Inside Sales.
2-pair (4 circuits per column) 3-pair (6 circuits per column) 4-pair (8 circuits per column) 5-pair (10 circuits per column)
Backplane Signal Header 5 Column Lite Open 10 Column Lite Open 25 Column Lite Open 10 Column Lite Guide Left 25 Column Lite Guide Left 10 Column Lite Guide Right 25 Column Lite Guide Right 5 Column Open 10 Column Open 25 Column Open 10 Column Guide Left 25 Column Guide Left 10 Column Guide Right 25 Column Guide Right
Order No. 75861-0504 75861-0104 75861-0204 75861-2104 75861-2204 75861-4104 75861-4204 N/A 75827-0104 75827-0204 75827-2104 75827-2204 75827-4104 75827-4204
Circuits 25 50 125 50 125 50 125 N/A 40 100 40 100 40 100
Order No. 75649-0504 75649-0104 N/A N/A N/A N/A N/A 75433-0504 75433-0104 75433-0204 75433-2104 75433-2204 75433-4104 75433-4204
Circuits 40 80 N/A N/A N/A N/A N/A 30 60 150 60 150 60 150
Order No. 75465-0505 75465-0104 75465-0204 75465-2104 75465-2204 75465-4104 75465-4204 N/A 75235-0104 75235-0204 75235-2104 75235-2204 75235-4104 75235-4204
Circuits 55 110 275 110 275 110 275 N/A 80 200 80 200 80 200
Order No. N/A N/A N/A N/A N/A N/A N/A N/A 75237-0104 75237-0204 75237-2104 75237-2204 75237-4104 75237-4204
Circuits N/A N/A N/A N/A N/A N/A N/A N/A 100 250 100 250 100 250
Backplane Power and Guide Components
Backplane power & Guide components 2-pair order no. circuits order no. 3-pair circuits order no. 4-pair circuits order no. 5-pair circuits
Power Stand-Alone Guide Pin Kit
75492-1066 75234-1508
4
75331-0444 75234-1469
6
75341-4444 75234-1469
8
75517-7766 75234-1469
10
americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com
Order No. USA-250 Rev. 1
asia pacific north Headquarters Yamato, Kanagawa, Japan 81-46-265-2325 apninfo@molex.com
asia pacific south Headquarters Jurong, Singapore 65-6268-6868 fesinfo@molex.com
Printed in USA/JI/2007.09
european Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com
Visit our website at www.molex.com/product/backplan/gbx.html
corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352
(c)2007, Molex

▲Up To Search▲

Price & Availability of 75341-4444

	To Download 75341-4444 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .